Kari Schjølberg-Henriksen

Seniorrådgiver - Forskningsadministrasjon
Bilde av Kari Schjølberg-Henriksen
English version of this page
Telefon +47-22859214
Mobiltelefon 93066911
Faks +47-22856422
Brukernavn
Besøksadresse Klaus Torgårds vei 3 Sogn Arena 0372 OSLO
Postadresse Postboks 1078 Blindern 0316 OSLO

Arbeidsområder

Forskningsadministrasjon med fokus på EU.

  • Kontaktpunkt for KLINMED på det Medisinske Fakultetet
  • Bistand og rådgivning til enkeltforskere og institutter angående ekstern forskningsfinansiering
  • Koordinering av søknadsprosesser til forskningssatsinger og prosjekter
  • Hjelp og rådgivning knyttet til regelverk og søknader i EU og Forskningsrådet

Bakgrunn

  • Seniorforsker, SINTEF IKT, Avdeling for mikrosystemer og nanoteknologi (2003 – 2016)
  • PhD, fysikalsk elektronikk, UiO (2003)
  • Forsker, SINTEF IKT, Avdeling for mikrosystemer (1997 – 1999)
  • Siv. ing eksperimentalfysikk, NTNU (1996)
Emneord: Forskningsadministrasjon, EU, Ekstern finansiering, Utlysninger, Forskningsrådet, Forskningsstøtte

Publikasjoner

  • Goorsky, M.S.; Schjølberg-Henriksen, Kari; Beekley, Brett; Marathe, N.; Mani, K.; Bajwa, A & Iyer, S. S. (2017). Low temperature metal-metal bonding for heterogeneous integration and performance scaling, In  2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, 16-18 May 2017.  IEEE.  ISBN 978-4-904743-03-4.  18GO-02.
  • Malik, Nishant; Venkatachalapathy, Vishnukanthan; Dall, Wilhelm; Schjølberg-Henriksen, Kari; Poppe, Erik Utne; Taklo, Maaike M. Visser & Finstad, Terje (2017). Texture of Al films for wafer-level thermocompression bonding. Superlattices and Microstructures.  ISSN 0749-6036.  106, s 216- 233 . doi: 10.1016/j.spmi.2017.03.053
  • Schjølberg-Henriksen, Kari; Gjessing, Jo; Bakke, Kari Anne Hestnes; Hadzialic, Sanja & Wang, Dag Thorstein (2017). Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding, In Graham Reed & Andrew P. Knights (ed.),  Silicon Photonics XII.  SPIE - International Society for Optical Engineering.  ISBN 9781510606579.  art. no. 101080P.
  • Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T. & Finstad, Terje (2017). Al-Al Wafer-Level Thermocompression Bonding applied for MEMS, In  2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, 16-18 May 2017.  IEEE.  ISBN 978-4-904743-03-4.  artikkel.  s 11 - 11
  • Rebhan, Bernhard; Hinterreiter, Andreas; Malik, Nishant; Schjølberg-Henriksen, Kari; Dragoi, Viorel & Hingerl, Kurt (2016). Low-Temperature Aluminum-Aluminum Wafer Bonding. ECS Transactions.  ISSN 1938-5862.  75(9), s 15- 24 . doi: 10.1149/07509.0015ecst
  • Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T. & Schjølberg-Henriksen, Kari (2015). Non-destructive wafer-level bond defect identification by scanning acoustic microscopy. Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems.  ISSN 0946-7076.  21(7), s 1385- 1394 . doi: 10.1007/s00542-014-2328-z
  • Malik, Nishant; Poppe, Erik; Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser & Finstad, Terje (2015). Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity. ECS Journal of Solid State Science and Technology.  ISSN 2162-8769.  4(7), s P251- P257 . doi: 10.1149/2.0181507jss
  • Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser & Finstad, Terje (2015). Impact of SiO2 on Al–Al thermocompression wafer bonding. Journal of Micromechanics and Microengineering.  ISSN 0960-1317.  25:035025(3) . doi: 10.1088/0960-1317/25/3/035025
  • Malik, Nishant; Tofteberg, Hannah Rosquist; Poppe, Erik; Finstad, Terje & Schjølberg-Henriksen, Kari (2015). Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity. ECS Journal of Solid State Science and Technology.  ISSN 2162-8769.  4(7), s P236- P241 . doi: 10.1149/2.0201507jss
  • Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin; Fournel, Frank & Moe, Sigurd T. (2015). Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints. ECS Journal of Solid State Science and Technology.  ISSN 2162-8769.  4(7), s P265- P271 . doi: 10.1149/2.0271507jss
  • Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik & Wang, Dag Thorstein (2015). Conductivity of high-temperature annealed silicon direct wafer bonds. Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems.  ISSN 0946-7076.  21(5), s 979- 985 . doi: 10.1007/s00542-015-2435-5
  • Malik, Nishant; Poppe, Erik; Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser & Finstad, Terje (2014). Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding, In Hubert Moriceau; H Baumgart; M.S. Goorsky; K.D. Hobart; R. Knechtel; T. Suga & C.S. Tan (ed.),  2014 ECS and SMEQ Joint International Meeting, October 5, 2014 - October 9, 2014 Semiconductor Wafer Bonding 13: Science, Technology, and Applications.  The Electrochemical Society.  ISBN 978-1-62332-185-7.  artikkel.  s 149 - 160
  • Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser & Finstad, Terje (2014). Al-Al thermocompression bonding for wafer-level MEMS sealing. Sensors and Actuators A-Physical.  ISSN 0924-4247.  211, s 115- 120 . doi: 10.1016/j.sna.2014.02.030
  • Malik, Nishant; Tofteberg, Hannah Rosquist; Poppe, Erik; Finstad, Terje & Schjølberg-Henriksen, Kari (2014). Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature, In Hubert Moriceau; H Baumgart; M.S. Goorsky; K.D. Hobart; R. Knechtel; T. Suga & C.S. Tan (ed.),  2014 ECS and SMEQ Joint International Meeting, October 5, 2014 - October 9, 2014 Semiconductor Wafer Bonding 13: Science, Technology, and Applications.  The Electrochemical Society.  ISBN 978-1-62332-185-7.  artikkel.  s 167 - 176
  • Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin & Moe, Sigurd T. (2014). Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints, In Hubert Moriceau; H Baumgart; M.S. Goorsky; K.D. Hobart; R. Knechtel; T. Suga & C.S. Tan (ed.),  2014 ECS and SMEQ Joint International Meeting, October 5, 2014 - October 9, 2014 Semiconductor Wafer Bonding 13: Science, Technology, and Applications.  The Electrochemical Society.  ISBN 978-1-62332-185-7.  artikkel.  s 275 - 284
  • Schjølberg-Henriksen, Kari; Malik, Nishant; Sandvand, Åsmund; Kittilsland, Gjermund & Moe, Sigurd T. (2014). Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding, In Hubert Moriceau; H Baumgart; M.S. Goorsky; K.D. Hobart; R. Knechtel; T. Suga & C.S. Tan (ed.),  2014 ECS and SMEQ Joint International Meeting, October 5, 2014 - October 9, 2014 Semiconductor Wafer Bonding 13: Science, Technology, and Applications.  The Electrochemical Society.  ISBN 978-1-62332-185-7.  artikkel.  s 305 - 314
  • Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Moe, Sigurd T.; Poppe, Erik; Wang, Dag Thorstein; Gjelstad, Stein Are; Mørk, Christopher & Imenes, Kristin (2014). Bond strength of conductive Si-Si bonded seals, In Bernard Courtois; Jean Michel Karam; Romolo Marcelli; Souhil Megherbi; Yoshio Mita; Pascal Nouet & J. Andrew Yeh (ed.),  Symposium on Design, test, Integration & Packaging of MEMS/MOEMS, Cannes, France, 1-4 April, 2014.  EDA Publishing Association.  ISBN 9782355000287.  Artikkel.  s 312 - 317
  • Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Tofteberg, Hannah Rosquist; Poppe, Erik; Vella, David Oscar; Borg, Joshua; Attard, Alastair; Hajdarevic, Zlatko; Klumpp, Armin & Ramm, Peter (2014). Low-temperature bonding technologies for MEMS and 3D-IC, In Tadatomo Suga (ed.),  2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, Japan, 15-16 July 2014.  IEEE.  ISBN 978-1-4799-5260-1.  artikkel.  s 129 - 133
  • Tofteberg, Hannah Rosquist; Schjølberg-Henriksen, Kari; Fasting, Eivind Johan; Moen, Alexander Stene; Taklo, Maaike Margrete Visser; Poppe, Erik & Simensen, Christian Julius (2014). Wafer-level Au–Au bonding in the 350–450 ◦C temperature range. Journal of Micromechanics and Microengineering.  ISSN 0960-1317.  24(8) . doi: 10.1088/0960-1317/24/8/084002 Fulltekst i vitenarkiv
  • Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik & Finstad, Terje (2013). Al-Al thermocompression bonding for wafer-level MEMS packaging , In  The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII, Barcelona, Spain June 16-20.  IEEE conference proceedings.  ISBN 978-1-4673-5982-5.  Artikkel.  s 1067 - 1070
  • Due-Hansen, Jon; Midtbø, Kjersti; Poppe, Erik; Summanwar, Anand; Jensen, Geir Uri; Breivik, Lars; Wang, Dag Thorstein & Schjølberg-Henriksen, Kari (2012). Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias. Journal of Micromechanics and Microengineering.  ISSN 0960-1317.  22(7) . doi: 10.1088/0960-1317/22/7/074009
  • Lapadatu, Adriana Cozma & Schjølberg-Henriksen, Kari (2012). Anodic bonding , In Peter Ramm; James Jian-Qiang Lu & Maaike Margrete Visser Taklo (ed.),  Handbook of wafer bonding.  Wiley-VCH Verlagsgesellschaft.  ISBN 978-3-527-32646-4.  Chapter 4.  s 63 - 80
  • Midtbø, Kjersti; Rønnekleiv, Arne; Ingebrigtsen, Kjell A.; Due-Hansen, Jon; Poppe, Erik; Wang, Dag Thorstein; Jensen, Geir Uri & Schjølberg-Henriksen, Kari (2012). High-frequency CMUT Arrays with Phase-steering for in vivo Ultrasound Imaging , In  IEEE sensors 2012, October 28-31, 2012, Taipei, Taiwan, Proceedings.  IEEE conference proceedings.  ISBN 978-1-4577-1765-9.  Acoustic/Resonant Sensors.  s 826 - 829
  • Tollefsen, Torleif Andre; Larsson, Andreas; Taklo, Maaike Margrete Visser; Poppe, Erik & Schjølberg-Henriksen, Kari (2012). Die shear strength as a function of bond frame geometry – Au-Au thermo-compression bonding , In  4th Electronics System-Integration Technology Conference (ESTC 2012).  IEEE conference proceedings.  ISBN 978-1-4673-4645-0.  Artikkel.  s 1 - 6
  • Khan, MF; Ghavanini, FA; Haasl, S; Lofgren, L; Persson, K; Rusu, C; Schjølberg-Henriksen, Kari & Enoksson, P (2010). Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding. Journal of Micromechanics and Microengineering.  ISSN 0960-1317.  20(6) . doi: 10.1088/0960-1317/20/6/064020
  • Lietaer, Nicolas; Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari & Ramm, Peter (2010). (Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications. ECS Transactions.  ISSN 1938-5862.  25(38), s 87- 95 . doi: 10.1149/1.3390661 Fulltekst i vitenarkiv
  • Taklo, Maaike Margrete Visser; Mielnik, Michal Marek; Schjølberg-Henriksen, Kari; Storås, Preben; Tofteberg, Hannah Rosquist; Lietaer, Nicolas & Johannessen, Rolf (2010). Technologies enabling 3D stacking of MEMS, In B Michel & K-D Lang (ed.),  Smart Systems Integration and ReliabilityHonory volume on occasion ofHerbert Reichl's 65th birthday.  Goldenbogen Verlag.  ISBN 978-3-932434-77-8.  Technologies enabling 3D stacking of MEMS.  s 136 - 145 Fulltekst i vitenarkiv
  • Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Lietaer, Nicolas; Prainsack, Josef; Elfving, Anders; Weber, Josef; Klein, Matthias; Schneider, Peter & Reitz, Sven (2010). 3D Integration of MEMS and IC: Design, Technology and Simulations, In Evgeni Gusev; Eric Garfunkel & Arthur Dideikin (ed.),  Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators (NATO Science for Peace and Security Series B: Physics and Biophysics).  Springer.  ISBN 904813806X.  3D Integration of MEMS and IC.  s 191 - 203
  • Herbjørnrød, Aina; Schjølberg-Henriksen, Kari; Angelskår, Hallvard & Lacolle, Matthieu Jean P (2009). Resist evaluation for fabrication of diffractive optical elements (DOEs) with sub-micron resolution in a MEMS production line. Journal of Micromechanics and Microengineering.  ISSN 0960-1317.  19(12) . doi: 10.1088/0960-1317/19/12/125022
  • Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser; Prainsack, Josef; Dielacher, Markus; Klein, Matthias; Weber, Josef; Lietaer, Nicolas; Seppanen, Timo; Wolf, Jurgen & Ramm, Peter (2009). Miniaturised sensor node for tire pressure monitoring (e-CUBES), In Gereon Meyer; Jürgen Valldorf & Wolfgang Gessner (ed.),  Advanced Microsystems for Automotive Applications - Smart systems for safety, sustainability, and comfort.  Springer.  ISBN 9783642007446.  Miniaturised sensor node for tire pressure monitoring (e-CUBES).  s 313 - 332
  • Schjølberg-Henriksen, Kari; Moe, Sigurd T.; Taklo, Maaike Margrete Visser; Storas, P & Ulvensøen, Jon Herman (2008). Low-temperature plasma activated bonding for a variable optical attenuator. Sensors and Actuators A-Physical.  ISSN 0924-4247.  142(1), s 413- 420 . doi: 10.1016/j.sna.2007.02.020
  • Schjølberg-Henriksen, Kari; Schulz, Olaf; Ferber, Alain Marc C; Moe, Sigurd T.; Lloyd, Martin; Muller, Gerhard; Suphan, Karl-Heinz; Wang, Dag Thorstein & Bernstein, Ralph W. (2008). Sensitive and Selective Photoacoustic Gas Sensor Suitable for High-Volume Manufacturing. IEEE Sensors Journal.  ISSN 1530-437X.  8(9-10), s 1539- 1545 . doi: 10.1109/JSEN.2008.923588
  • Schjølberg-Henriksen, Kari; Ferber, Alain Marc C; Moe, Sigurd T.; Wang, Dag Thorstein; Bernstein, Ralph W.; Rogne, Henrik; Schulz, O.; Lloyd, M.; Suphan, K.-H. & Müller, G. (2006). Sensitive and Selective Photo Acoustic Gas Sensor Suitable for High Volume Manufacturing , In  5th IEEE Conference on Sensors, 2006.  IEEE.  ISBN 1424403766.  s 679 - 682
  • Schjølberg-Henriksen, Kari; Poppe, Erik; Moe, Sigurd T.; Storås, Preben; Taklo, Maaike Margrete Visser; Wang, Dag Thorstein & Jakobsen, Henrik (2006). Anodic bonding of glass to aluminum . Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems.  ISSN 0946-7076.  12, s 441- 450
  • Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Rogne, Henrik; Ferber, Alain Marc C; Vogl, Andreas; Moe, Sigurd T.; Bernstein, Ralph W.; Lapadatu, Daniel; Sandven, Knut & Brida, Sebastiano (2006). High-resolution pressure sensor for photo acoustic gas detection. Sensors and Actuators A-Physical.  ISSN 0924-4247.  132, s 207- 213
  • Schjølberg-Henriksen, Kari; Jensen, Geir Uri; Hanneborg, Anders & Jakobsen, Henrik (2004). Anodic bonding for monolithically integrated MEMS. Sensors and Actuators A-Physical.  ISSN 0924-4247.  (A 114), s 332- 339
  • Taklo, Maaike Margrete Visser; Storås, Preben; Schjølberg-Henriksen, Kari; Hastings, HK & Jakobsen, Henrik (2004). Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold. Journal of Micromechanics and Microengineering.  ISSN 0960-1317.  14, s 884- 890
  • Schjølberg-Henriksen, Kari; Jensen, Geir Uri; Hanneborg, Anders & Jakobsen, Henrik (2003). Sodium contamination of SiO2 caused by anodic bonding. Journal of Micromechanics and Microengineering.  ISSN 0960-1317.  13(6), s 845- 852
  • Schjølberg-Henriksen, Kari (2002). Modelling of charging effects caused by anodic bonding in packed MOS devices. Electronics Letters.  ISSN 0013-5194.  38(24), s 1596- 1597
  • Schjølberg-Henriksen, Kari; Fjeldly, Tor A; Santander, Joaquín; Plaza, Jose Antonio & Hanneborg, Anders Bror (2002). Modelling of charging effects caused by anodic bonding in packaged MOS devices. Electronics Letters.  ISSN 0013-5194.  38(24), s 1596- 1697
  • Schjølberg-Henriksen, Kari; Hanneborg, Anders Bror; Jensen, Geir Uri; Lapadatu, Adriana C. & Jakobsen, Henrik (2002). Electrical effects of anodic bonding on silicon dioxide situated in Pyrex cavities. Journal of the Electrochemical Society.  ISSN 0013-4651.  149(8), s G497- G503
  • Schjølberg-Henriksen, Kari; Plaza, Jose Antonio; Rafí, Joan Marc; Esteve, Jaume; Campabadal, Francesca; Santander, Joaquín; Jensen, Geir Uri & Hanneborg, Anders (2002). Protection of MOS capacitors during anodic bonding. Journal of Micromechanics and Microengineering.  ISSN 0960-1317.  12(4), s 361- 368
  • Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser; Hanneborg, Anders Bror & Jensen, Geir Uri (2002). Oxide charges induced by plasma activation for wafer bonding. Sensors and Actuators A-Physical.  ISSN 0924-4247.  102(1-2), s 99- 105
  • Moe, Sigurd T.; Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Lund, E; Nysæther, J; Furuberg, Liv; Taklo, Maaike Margrete Visser; Fallet, Truls & Bernstein, R W (2000). Capative Differential Pressure sensor for Harsh Environment. Sensors and Actuators A-Physical.  ISSN 0924-4247.  83(1-3), s 30- 33
  • Moe, Sigurd T.; Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Lund, Eivind; Nysæther, Jon Barratt; Furuberg, Liv; Taklo, Maaike Margrete Visser; Fallet, Truls & Bernstein, R. W. (2000). Capacitive differential pressure sensor for harsh environments. Sensors and Actuators A-Physical.  ISSN 0924-4247.  83(1-3), s 30- 33
  • Schjølberg-Henriksen, Kari; Westgaard, T & Avset, Berit Sundby (2000). HERA-B Detectors with P-spray Isolaton on th N-side; Unirradiated Results. IEEE Transactions on Nuclear Science.  ISSN 0018-9499.  47(4, part 1), s 1371- 1374
  • Schjølberg-Henriksen, Kari; Westgaard, Trond & Avset, Berit Sundby (2000). HERA-B Detectors with P-spray Isolation on the N-Side; Unirradiated Results. IEEE Transactions on Nuclear Science.  ISSN 0018-9499.  47(4), s 1371- 1374
  • Avset, Berit Sundby; Evensen, Lars; Jensen, Geir Uri; Mo, Sjur; Schjølberg-Henriksen, Kari & Westgaard, Trond Inge (1998). Recent detector developments at SINTEF (industrial presentation). Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment.  ISSN 0168-9002.  409, s 147- 151

Se alle arbeider i Cristin

  • Goorsky, M.S.; Schjølberg-Henriksen, Kari; Beekley, Brett; Marathe, N.; Mani, K.; Bajwa, A & Iyer, S. S. (2017). Low temperature metal-metal bonding for heterogeneous integration and performance scaling.
  • Schjølberg-Henriksen, Kari; Gjessing, Jo; Bakke, Kari Anne Hestnes; Hadzialic, Sanja & Wang, Dag Thorstein (2017). Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding.
  • Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T. & Finstad, Terje (2017). Al-Al Wafer-Level Thermocompression Bonding applied for MEMS.
  • Kok, Angela; Povoli, Marco & Schjølberg-Henriksen, Kari (2016, 08. november). Microscopic sensor for more precise radiology treatments . [Internett].  Geminiresearchnews.com.
  • Rebhan, Bernhard; Hinterreiter, Andreas; Malik, Nishant; Schjølberg-Henriksen, Kari; Dragoi, Viorel & Hingerl, Kurt (2016). Low-Temperature Aluminum-Aluminum Wafer Bonding.
  • Wright, Daniel Nilsen; Belle, Branson; Schjølberg-Henriksen, Kari; Nguyen, Hoang-Vu; Gakkestad, Jakob; Kristiansen, Helge & Taklo, Maaike M. Visser (2016). Anisotropic conductive film for fine-pitch interconnects . Proceedings of the International Symposium on Microelectronics.  ISSN 2380-4505.  2016(1) . doi: 10.4071/isom-2016-TP23
  • Wright, Daniel Nilsen; Taklo, Maaike Margrete Visser; Belle, Branson; Kristiansen, Helge; Gakkestad, Jakob; Nguyen, Hoang-Vu & Schjølberg-Henriksen, Kari (2016). Anisotropic conductive film for fine-pitch interconnects.
  • Beekley, Brett; Bai, Tingyu; Marathe, N.; Tofteberg, Hannah Rosquist; Malik, Nishant; Schjølberg-Henriksen, Kari & Goorsky, Mark (2015). Au-Au bonded interface microstructure and nanostructure formation during low temperature annealing.
  • Malik, Nishant; Venkatachalapathy, Vishnukanthan; Poppe, Erik; Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser & Finstad, Terje (2015). Grain structure of Aluminium films for wafer-level thermocompression bonding.
  • Malik, Nishant; Poppe, Erik; Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser & Finstad, Terje (2014). Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding.
  • Malik, Nishant; Poppe, Erik; Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser & Finstad, Terje (2014). Hermeticity and reliability characterization of Al-Al thermocompression bonding.
  • Malik, Nishant; Tofteberg, Hannah Rosquist; Poppe, Erik; Finstad, Terje & Schjølberg-Henriksen, Kari (2014). Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature.
  • Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin & Moe, Sigurd T. (2014). Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints.
  • Schjølberg-Henriksen, Kari; Malik, Nishant; Sandvand, Åsmund; Kittilsland, Gjermund & Moe, Sigurd T. (2014). Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding.
  • Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik & Wang, Dag Thorstein (2014). Bond strength of conductive Si-Si fusion bonded seals.
  • Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Tofteberg, Hannah Rosquist; Poppe, Erik; Vella, David Oscar; Borg, Joshua; Hajdarevic, Zlatko; Klumpp, Armin & Ramm, Peter (2014). Low-temperature bonding technologies for MEMS and 3D-IC.
  • Tofteberg, Hannah Rosquist; Schjølberg-Henriksen, Kari; Mielnik, Michal Marek & Lapique, Fabrice (2014). SINTEF MiNaLab .
  • Vereshchagina, Elizaveta; Poppe, Erik; Schjølberg-Henriksen, Kari; Venkatachalapathy, Vishnukanthan & Moe, Sigurd T. (2014). ANALYSIS OF RESIDUAL STRESS AND THERMAL HYSTERESIS IN SPUTTERED ALUMINIUM THIN FILMS.
  • Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik & Finstad, Terje (2013). Al-Al thermocompression bonding for wafer-level MEMS packaging.
  • Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike Margrete Visser & Finstad, Terje (2013). Optimization of Al-Al thermocompression bonding.
  • Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik & Wang, Dag Thorstein (2013). Conductive hydrophilic and hydrophobic high-temperature silicon direct wafer bonding.
  • Tofteberg, Hannah Rosquist; Schjølberg-Henriksen, Kari; Fasting, Eivind Johan; Moen, Alexander Stene; Taklo, Maaike Margrete Visser; Poppe, Erik & Simensen, Christian Julius (2013). Wafer-level Au-Au thermocompression bonding for hermetic device sealing.
  • Kok, Angela; Hansen, Thor-Erik; Schjølberg-Henriksen, Kari; Rosenfeld, Anatoly B.; Lerch, Michael L.F.; Petasecca, M; Da Via, Cinzia; Svensson, Bengt Gunnar; Monakhov, Edouard; Røhrich, Dieter; Sandaker, Heidi; Morse, John C; Bräuer-Krisch, Elke; Bravin, Alberto & Tran, Linh T. (2012). Proposed fabrication of 3D silicon sensors as a mini and micro-dosimeter for quality assurance in conventional and hadron therapy.
  • Midtbø, Kjersti; Due-Hansen, Jon; Poppe, Erik; Rønnekleiv, Arne; Wang, Dag Thorstein; Ingebrigtsen, Kjell A.; Jensen, Geir Uri & Schjølberg-Henriksen, Kari (2012). High-frequency CMUT Arrays with Phase-steering for in vivo Ultrasound Imaging.
  • Schjølberg-Henriksen, Kari; Moen, Alexander Stene; Fasting, Eivind Johan & Poppe, Erik (2012). Yield and strength of metal wafer-level MEMS device sealing using Al, Au, or Ti.
  • Tollefsen, Torleif Andre; Larsson, Andreas; Taklo, Maaike Margrete Visser; Poppe, Erik & Schjølberg-Henriksen, Kari (2012). Die shear strength as a function of bond frame geometry – Au-Au thermocompression bonding.
  • Lietaer, Nicolas; Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari & Ramm, Peter (2009). 3D interconnect technologies for advanced MEMS/NEMS applications. Fulltekst i vitenarkiv
  • Schjølberg-Henriksen, Kari (2009). 3D Integration of MEMS and IC: Design, technology and simulations. Fulltekst i vitenarkiv
  • Schjølberg-Henriksen, Kari (2009). MEMS structures for wafer-level bonding characterization.
  • Wang, Dag Thorstein & Schjølberg-Henriksen, Kari (2009). Application-specific Smart System Integration.
  • Schjølberg-Henriksen, Kari; Ferber, Alain Marc C; Wang, Dag Thorstein; Moe, Sigurd T.; Schulz, O.; Lloyd, M.; Suphan, K-H.; Bernstein, R.W.; Rogne, H. & Müller, G. (2006). Sensitive and Selective Photo Acoustic Gas Sensor Suitable for High Volume Manufacturing.
  • Midtbø, Kjersti; Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser & Rønnekleiv, Arne (2005). Surface energy of fusion bonded silicon nitride to silicon.
  • Jakobsen, Henrik; Schjølberg-Henriksen, Kari; Poppe, Erik; Moe, S; Taklo, Maaike Margrete Visser & Wang, Dag Thorstein (2004). Anodic bonding of glass to aluminium.
  • Schjølberg-Henriksen, Kari; Hanneborg, Anders Bror; Jensen, Geir Uri & Jakobsen, Henrik (2002). Sodium contamination of SiO2 caused by anodic bonding.
  • Schjølberg-Henriksen, Kari; Lapadatu, Adriana C.; Jensen, Geir Uri; Hanneborg, Anders Bror & Jakobsen, Henrik (2001). Effect of Anodic Bonding on Reliability of Sensors and MOS Circuitry.
  • Schjølberg-Henriksen, Kari; Plaza, Jose Antonio; Rafí, Joan Marc; Esteve, Jaume; Campabadal, Francesca; Santander, Joaquín; Jensen, Geir Uri & Hanneborg, Anders Bror (2001). Protection of MOS Capacitors during Anodic Bonding.
  • Schjølberg-Henriksen, Kari; Dlugokinski, Marion; Lapadatu, Adriana C.; Jensen, Geir Uri; Hanneborg, Anders Bror; Finstad, Terje & Jakobsen, Henrik (2000). Charging Effects in SiO2 during Anodic Bonding Measured on MOS Capacitors Situated Outside the Bonding Area.
  • Schjølberg-Henriksen, Kari; Westgaard, Trond & Avset, Berit Sundby (1999). HERA-B Detectors with P-Spray Isolation on the N-Side, Unirradiated Results.
  • Taklo, Maaike Margrete Visser; Wang, Dag Thorstein; Moe, S. T.; Schjølberg-Henriksen, Kari & Hanneborg, Anders Bror (1999). Pressure Sensor for Harsh Environments Realized by Triple-Stack Fusion Bonding.

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Publisert 9. aug. 2016 10:26 - Sist endret 9. sep. 2016 10:08